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Wire Bonders Manual and. Semi-Automatic ; Ball Bonder, Palomar Technologies 2728 Loker Ave, West Carlsbad, CA 92010. USA, Tel: +1-760-931-3600 A microelectronic wire bond is a wire piece typically between 15 and 50μm in diameter, Shinkawa Ltd., Palomar Technologies, Kaijo Co., and others.Find Hughes 2460-III Gold Ball Wire Bonder with Manuals and Accessories - Palomar, Surplus Store at RecycledGoods.com | Ventura California | (888) 488-6550 The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on A fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping,. Consult PALOMAR TECHNOLOGIES's Model 8000 Wire Bonder & Ball Bumper brochure on DirectIndustry. Page: 1/2. Download the brochures! Hybond Manual and Semi-Automatic Wire Bonder, Die Bonder, Wedge Bonder & Peg Bonders.
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